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Location and Contact
The Trion Phantom etcher is located in the plasma etch bay of the WCAM cleanroom.
This is a class 10 cleanroom. Please contact WCAM for access.
http://www.engr.wisc.edu/centers/wcam/
Process Description
The Trion Phantom etcher has an Inductively Coupled Plasma (ICP) source.
The ICP allows the user to create high-density plasma. High-density plasma
results in increased etch rates and anisotropy. An electrostatic chuck
provides increased sample cooling during the etching process. Cooling
temperatures as low as -40ºC can be achieved.
Equipment Description
The system is controlled via a PC interface with touch screen controls.
The Phantom has both 1000 Watt ICP and 600 Watt RIE power supplies. The
etcher can accommodate a wide variety of substrate sizes.
Etch Gases Available
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