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The MRSEC Facilities Network is a nationwide partnership of NSF supported MRSEC centers designed to provide support to researchers in the broad area of Materials Research in academic, government and industrial laboratories around the world.
Tencor P10 Profilometer

Tencor P10 Profilometer

Description

The profiler is a computerized, highly sensitive surface profiler that measures roughmess, waviness, step height, and other surface characteristics in a variety of applications. It features the ability to measure micro-roughness with up to 0.5 Å (0.002 µin.) resolution over short distances as well as waviness over a full, 60 mm (2 inch) maximum scan length. The built-in PC computing power offers precise, automatic measurement capability with the convenience and ease of use of Microsoft Windows based software control and data analysis.

Applications:

  • Semi-conducter wafers.
  • Thin-film heads.
  • Precision-machined and polished surfaces.
  • Ceramics for micro-electronics.
  • Glass for flat panel displays.
  • Optical Surfaces.
  • Polymers.

Capabilities:

  • Vertical range for the optional Low-Force MicroHead II is from under 50 Å to 130µm at <0.1-, and 1-Å verical data resolution.
  • Photo-realistic rendering of the scan data in three dimensions for extended surface analysis.
  • A virually unlimited number of data points per profile, which guarantees that the horizontal resolution is limited by the stylus radius and not by the number of data points.
  • Measurement of many roughness and waviness parameters, with user selectable cutoff filters to isolate roughness and waviness.
  • Ability to fit and level a scan, allowing accurate step height measurements on curved surfaces.
  • Ability to detect the edge or apex of a profile feature, allowing automated data analysis relative to the feature.
  • Ability to repeat a scan up to ten times and automatically calculate the average, thereby minimizing the effects of environmental noise on measurements.
  • Automatic positioning on the sample surface to within a few microns in X and Y.
  • Precision mode, allowing precise location of small features and de-skew coordinates for automatic operation.
  • Measurement of samples up to 350 mm (14 in.) wide, 57.2 mm (2.25 in.) thick, and 2.2 kg (5 lb) in weight.
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